Role and responsibility:
- Response in front of line process that major process are wire bonding, plasma and AOI.
- Perform process control and sustaining , quality and yield improvement.
- Problem analysis base on 5M 1E to find out corrective actions and support production, perform trouble shooting in production
- Design and develop wire bond recipe to optimize quality, delivery and cost improvement.
- Find and optimize tool that use at wire bond example capillary, top plate window clamp.
- Support quality buy-off for equipment and tool qualification.
- Support NPI/NTI projects qualification for selective projects.
- Create and maintain documentation for process control, set standard working.
- Understand change matrix, develop and doing evaluation reports for process capabilities improvement.
- Support internal and external audit, factory visit.
- Provide problem analysis report and 8D report in case factory escape or customer complaint.
- Collaborate with cross-functional team for problem solving, quality disposition and improvement projects.
Qualification
- Bachelor's or master's degree in electronic, electrical engineering or related field.
- 2-5 years experience or higher in wire bond process or semiconductor industry.
- Proven track record in optimizing manufacturing processes using Lean Six Sigma.
- Strong skills in SPC tools, Cpk analysis, and DoE techniques.
- In-depth understanding of semiconductor failure analysis and majority wire bond process.
- Experience in processing documentation
- Effective communication both Thai and English and organizational abilities.
- Proactive mindset with project management skills.
- Able to work under pressure.
- Able to work and manage multiple tasks
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