Role and responsibility:
Response in front of line process that major process are wire bonding, plasma and AOI.
Perform process control and sustaining , quality and yield improvement.
Problem analysis base on 5M 1E to find out corrective actions and support production, perform trouble shooting in production
Design and develop wire bond recipe to optimize quality, delivery and cost improvement.
Find and optimize tool that use at wire bond example capillary, top plate window clamp.
Support quality buy-off for equipment and tool qualification.
Support NPI/NTI projects qualification for selective projects.
Create and maintain documentation for process control, set standard working.
Understand change matrix, develop and doing evaluation reports for process capabilities improvement.
Support internal and external audit, factory visit.
Provide problem analysis report and 8D report in case factory escape or customer complaint.
Collaborate with cross-functional team for problem solving, quality disposition and improvement projects
Qualification
Bachelor's or master's degree in electronic, electrical engineering or related field.
2-5 years of experience or higher in wire bond process or semiconductor industry.
Proven track record in optimizing manufacturing processes using Lean Six Sigma.
Strong skills in SPC tools, Cpk analysis, and DoE techniques.
In-depth understanding of semiconductor failure analysis and majority wire bond process.
Experience in processing documentation
Effective communication both Thai and English and organizational abilities.
Proactive mindset with project management skills.
Able to work under pressure.
Able to work and manage multiple tasks
More information about NXP in Thailand...